How we design and make TECs

Our consultative approach is unique in the industry. We won’t ask you which TEC (thermoelectric cooler) you want—we’ll ask what it needs to do. With a complete thermal picture of your application, we leverage decades of thermal engineering expertise to develop the right configuration for you—one that maximizes efficiency and exceeds design targets and requirements.

Image of a TEC component


Uncompromised performance Uncompromised performance

Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

Unparalleled design Unparalleled design

We deliver unprecedented value and performance by partnering with customers throughout the entire design process—creating application-relevant products/devices/solutions.




Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.

Learn more
product to can tecs image

ReefTEC™ Non-Hermetic TEC Platform

Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.

Learn more
ReefTEC component


Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.

Learn more

Butterfly Package TECs

TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and Photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.

Learn more
Butterfly package

Ready to build with Phononic? Let’s make it together.