Box TOSA TECs
Phononic supports the cooling of box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. This series is perfect for 100G and higher applications, QSFP transceiver packages, and the long-reach requirements (LR4/10km and beyond) that are in demand from the growth of optical components used in data centers.
Cutting-edge technology.
Extreme reliability
The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Applications.
Data Communications
Discover performance at scale for high-volume production, including an industry-leading, cost-saving non-hermetic TEC platform.
Learn more
Telecommunications
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
Learn more
LiDAR
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
Learn more
How to buy Phononic
Europe / North America
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
Don’t see a distributor for your region?
See your application? Build it with our family of products.
Don’t see your application? Let’s make it together.
Resources.
Video
Lightwave Exclusive: Interview with Phononic at OFC 2024
Read more
Video
Lightwave Exclusive: Interview with Phononic at OFC 2023
Read more
Data sheet
TECs for 400/800G and Beyond
Phononic’s high-performance TECs cool next- generation optical communications components and circuits while reducing overall power consumption.
Read more
News
Phononic Featured in Laser Focus World
Alex Guichard, VP of Product Marketing at Phononic, discusses Phononic' s LiDAR thermoelectric cooling solution for the automotive industry.
Read more
Extreme reliability
The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Extreme reliability
The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Applications.
Data Communications
Discover performance at scale for high-volume production, including an industry-leading, cost-saving non-hermetic TEC platform.
Learn more
Telecommunications
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
Learn more
LiDAR
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
Learn more
How to buy Phononic
Europe / North America
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
Don’t see a distributor for your region?
See your application? Build it with our family of products.
Don’t see your application? Let’s make it together.
Resources.
Lightwave Exclusive: Interview with Phononic at OFC 2024
Read more
Lightwave Exclusive: Interview with Phononic at OFC 2023
Read more
TECs for 400/800G and Beyond
Phononic’s high-performance TECs cool next- generation optical communications components and circuits while reducing overall power consumption.
Read more
Phononic Featured in Laser Focus World
Alex Guichard, VP of Product Marketing at Phononic, discusses Phononic' s LiDAR thermoelectric cooling solution for the automotive industry.
Read more