Phononic supports the cooling of box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. This series is perfect for 100G and higher applications, QSFP transceiver packages, and the long-reach requirements (LR4/10km and beyond) that are in demand from the growth of optical components used in data centers.

Cutting-edge technology.

Uncompromised performance

Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

check mark icon Extreme reliability

The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.

Combine shape icon Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

Multiple integration options

With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.

How to buy Phononic

Europe / North America

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Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:

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