Phononic in Telecommunications
Phononic enables high-performance thermoelectric cooling that delivers what the telecom industry needs: high reliability and heat pumping density paired with significantly lower power consumption. Our solutions enable better cooling performance for high and low data rate transfer as well as long reaches.
Applications.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
Learn moreReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
Learn moreBox TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
Learn moreButterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
Learn moreSee your application? Build it with our family of products.
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Resources.
Lightwave Exclusive: Interview with Phononic at OFC 2023
Read moreTECs for 400/800G and Beyond
Phononic’s high-performance TECs cool next- generation optical communications components and circuits while reducing overall power consumption.
Read morePhononic Featured in Laser Focus World
Alex Guichard, VP of Product Marketing at Phononic, discusses Phononic' s LiDAR thermoelectric cooling solution for the automotive industry.
Read moreFMCW LiDAR Ebook
Light Detection and Ranging, or LiDAR, is a laser-based 3D-sensing technology used to generate high-resolution maps of different terrains.
Read more