Phononic in Telecommunications
Phononic enables high-performance thermoelectric cooling that delivers what the telecom industry needs: high reliability and heat pumping density paired with significantly lower power consumption. Our solutions enable better cooling performance for high and low data rate transfer as well as long reaches.
Benefits.
30% Lower power consumption
30% Lower power consumptionWith less power consumption, you’ll enable performance improvements while differentiating inside the laser package, where you’re not limited by standards.
Extreme reliability
Extreme reliabilityThe process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scales into production, as evidenced by a TEC return rate of 0% in mass production.
Exceptional design support
Exceptional design supportWe consult with you to understand the full thermal picture of your application and model it carefully before moving to the prototype, ensuring it’s designed right the first time and allowing you to qualify and launch your product faster.
Continuous innovation
Continuous innovationWe are driven by a need to innovate, and we’ll learn your product roadmap and align our TEC innovation efforts with it to support your needs.
Applications.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
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ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
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Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
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Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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See your application? Build it with our family of products.
Don’t see your application? Let’s make it together.
Resources.
5G eBook
What does the unavoidable rollout of 5G applications in the marketplace mean for all of the optical component manufacturers? Read more about it!
Read moreTECs for Cooling Critical Components in Automotive LiDAR Sensors
TECs for Cooling Critical Components in Automotive LiDAR Sensors
Read more2020 Top Trends and Predictions for the Opto Market
As the optoelectronics industry continues to see growth and anticipates more new technologies to be unveiled in the coming year, we can expect the same for optical communications.
Read moreAddressing TEC Reliability for LiDAR Applications
Dive further into our whitepaper discussing Reliability for LiDar Applications.
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