Devices AI/Datacenters TO Can TECs

TO Can TECs

Phononic delivers low-power consumption, high-performance TECs to efficiently cool TO can lasers, all configured for your specific application. This series is ideal for cost-effective lasers from 10G to 50G and beyond, including PON (passive optical networks), wireless network apps, and FTTx applications. This series, including our pico-TEC platform, can be used for cooling common package sizes such as TO56 (5.6mm diameter) and can support even smaller packages such as TO32 or TO40.

TO Can TECs
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Benefits.

Uncompromised performance

Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

Extreme reliability

The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scales into production, as evidenced by a TEC return rate of 0% in mass production.

Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

Multiple integration options

With many integration options available, from bare wire bond pads to high-temp solder to patterned cold-side metallization and more, you won’t be limited.

How to buy Phononic

Europe / North America

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Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:

Israel

Israel

China

China

Korea

Korea

Japan

Japan

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