Phononic in Data Communications
The transition to 400G is happening quickly, and higher speeds and capabilities will follow in the coming years. To stay competitive, transceiver companies need to innovate without increasing package cost. Our TECs deliver better power consumption and heat pumping density than alternatives, and supports the high-volume production quantities demanded by hyperscale datacenter applications.
Benefits.
60% Higher heat pumping density
60% Higher heat pumping density
Realize considerably higher heat pumping density, enabling dependable heat dissipation for shrinking form factors.
Exceptional design support
Exceptional design support
We study the full thermal picture of your TOSA design and model carefully before moving to the prototype, so you’ll know it’s right the first time.
30% Less power consumption
30% Less power consumption
This reduction is realized at the laser package level, so you can reduce your total transceiver power consumption and meet MSA specs without sacrificing laser performance or yield.
Cost-effective alternatives to uncooled
Cost-effective alternatives to uncooled
Our re-engineered TEC for non-hermetic applications delivers uncompromised performance while enabling dramatic package-level cost savings.
Quality that scales
Quality that scales
The precision and reliability of our TECs has been proven at scale, allowing you to meet the demands of high-volume production with confidence.
Shorten your NPI timelines
Shorten your NPI timelines
Our unique design process and application- specific devices help shorten development cycles so you can get your products to market quickly.
Applications.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
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ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
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Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
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Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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See your application? Build it with our family of products.
Don’t see your application? Let’s make it together.
Resources.
Lightwave Exclusive: Interview with Phononic at OFC 2023
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TECs for 400/800G and Beyond
Phononic’s high-performance TECs cool next- generation optical communications components and circuits while reducing overall power consumption.
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Phononic Featured in Laser Focus World
Alex Guichard, VP of Product Marketing at Phononic, discusses Phononic' s LiDAR thermoelectric cooling solution for the automotive industry.
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FMCW LiDAR Ebook
Light Detection and Ranging, or LiDAR, is a laser-based 3D-sensing technology used to generate high-resolution maps of different terrains.
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