Phononic in Data Communications
The transition to 400G is happening quickly, and higher speeds and capabilities will follow in the coming years. To stay competitive, transceiver companies need to innovate without increasing package cost. Our TECs deliver better power consumption and heat pumping density than alternatives, and supports the high-volume production quantities demanded by hyperscale datacenter applications.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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TECs for 400/800G and Beyond
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