Butterfly Package TECs

Phononic supports the cooling of butterfly laser packages with high-performance, low power-consumption TECs that withstand the challenges inherent in applications such as pump lasers, photonic integrated circuits, or LiDAR light sources. Butterfly packages require reliable, larger-sized, higher-density heat pumping TECs to support the amplification and transfer of data across extremely long distances. When the quality of global communications is at stake and there’s a massive construction budget on the line, you can’t settle for standard products. All of our TECs are configured to meet your needs.

Butterfly Package TECs


Uncompromised performance

Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

Extreme reliability

The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scales into production, as evidenced by a TEC return rate of 0% in mass production.

Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

Multiple integration options

With many integration options available, from bare wire bond pads to high-temp solder to patterned cold-side metallization and more, you won’t be limited.

How to buy Phononic

Europe / North America

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Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:

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