Fully optimized, in every way possible.
Our TECs for optical communication components are superior from end to end—in power consumption, performance vs. size, reliability, and quality. We custom-design our TECs to be optimized for any application and any need.
Engineering benefits.
Uncompromised performance
Our TECs deliver 60% higher heat pumping density with 30% lower power consumption, when compared to our competitors’ TECs.
Scalability
We strive to offer precision at scale when it comes to the assembly process. Our TECs are built in a US-based automated manufacturing facility to scale quickly from design into production, reducing NPI timelines.
Unparalleled design
Our design, simulation, and development proposal allows us to create a device that is tailor-made to exact customer needs, minimizing costly redesign risk and ensuring best-in-class performance.
Uncompromised performance
Our TECs deliver 60% higher heat pumping density with 30% lower power consumption, when compared to our competitors’ TECs.
Scalability
We strive to offer precision at scale when it comes to the assembly process. Our TECs are built in a US-based automated manufacturing facility to scale quickly from design into production, reducing NPI timelines.
Unparalleled design
Our design, simulation, and development proposal allows us to create a device that is tailor-made to exact customer needs, minimizing costly redesign risk and ensuring best-in-class performance.
Scalability
We strive to offer precision at scale when it comes to the assembly process. Our TECs are built in a US-based automated manufacturing facility to scale quickly from design into production, reducing NPI timelines.
Unparalleled design
Our design, simulation, and development proposal allows us to create a device that is tailor-made to exact customer needs, minimizing costly redesign risk and ensuring best-in-class performance.
Unparalleled design
Our design, simulation, and development proposal allows us to create a device that is tailor-made to exact customer needs, minimizing costly redesign risk and ensuring best-in-class performance.
We know and solve your challenges.
Products.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
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Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
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Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and Photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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Automotive LiDAR TECs
Our TECs for automotive LiDAR applications offer unrivaled active cooling performance and reliability. Work with us to design an application-specific TEC that’s optimized for your LiDAR sensor application!
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How to buy Phononic
Europe / North America
Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:
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