Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Reliable, High Performance Laser Packages
August 1, 2019
March 08, 2018 –
Phononic unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform, designed to provide high reliability and cooling performance, along with lower power consumption, for laser packaging. This advancement is a solid state, precision-cooling solution for sub-components within telecommunication and data center applications.
