Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Reliable, High Performance Laser Packages

August 1, 2019

March 08, 2018 – 

Phononic unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform, designed to provide high reliability and cooling performance, along with lower power consumption, for laser packaging. This advancement is a solid-state, precision-cooling solution for sub-components within telecommunication and data center applications.

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