Brief
September 12, 2019
Phononic Non-Hermetic Brief
Non-hermetic laser packages enable TOSA cost reductions but may fall short in extreme environments. Phononic's TECs are engineered to last. Read more!
Article
August 2, 2019
Addressing Reliability in a Non-Hermetic Laser Package
Cooled non-hermetic laser packages are one way of cutting costs while meeting the performance requirements of those demands.
Article
August 2, 2019
How a Non-Hermetic Laser Package Saves On Cost
Non-hermetic packaging can be reliable, but offers a significantly lower total cost than a hermetically-sealed package. Here are three main drivers of cost to consider.
News
August 1, 2019
Phononic Non-Hermetic Compatible Thermoelectric Cooler Targets Telecom, Datacom Laser Packages
Phononic is now offering a Non-Hermetic Compatible Thermoelectric Cooler (TEC) for communication lasers in the telecom and datacom industries.
News
August 1, 2019
Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Telecom and Datacom Laser Packages
Phononic has unveiled new proprietary thermoelectric cooler platform for laser packages within telecom and datacom. The new TEC platform will lower package costs for optical components manufacturers.
News
August 1, 2019
Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Reliable, High Performance Laser Packages
Phononic unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform, designed to provide high reliability and cooling performance with lower power consumption.
Article
June 14, 2019
Why Uncooled Laser Packages Aren’t the Cost-Saving Answer in 5G
The use of non-hermetic components can deliver significant cost savings on the TOSA, as much as 50% – if the right non-hermetic TECs are chosen.
Article
June 13, 2019
Addressing the Technical Challenges of Non-hermetic Laser Packages
Optical component manufacturers are facing pressure to find cost-effective laser package solutions to help reduce their final product cost. Non-hermetics laser packages introduce design challenges.