Unmatched Bandwidth, Efficiency and Reliability
CPO is the Next Frontier to Meet AI Data Center Demands
​Exponentially growing bandwidth demands are driving an inevitable evolution to tightly integrating optics with switching silicon through co-packaged optics to allow networks to keep pace.
By ensuring precise temperature stability for lasers and optical components placed alongside the switch ASIC, solid state TECs enhance performance and stability while enabling higher-density, lower-power and scalable networks.
In addition to addressing the extreme thermal challenges of external laser sources, Phononic’s approach to CPO cooling is perfectly suited for the inevitable market transition to co‑packaged optics more broadly, unlocking additional performance headroom, reducing signal‑path distance and associated energy draw, enabling the scale and bandwidth density required for next‑generation fabrics while not compromising on quality or uptime requirements.
Thermal Kit for CPO
Benefits of Phononic Solutions for CPO
Phononic’s CPO-Ready Thermal Kit: Advanced packaging and localized cooling for co-packaged optical engines in scale out and scale up applicationsÂ
Higher Bandwidth Density
Eliminating the need for long, high-speed electrical traces between the switch ASIC and the optical modules, CPO allows for many more optical channels to be placed in the same physical footprint, thus enabling far denser, higher-throughput connects. Phononic’s proprietary 3D modeling enables our FAEs to design solutions that accurately model and mitigate the effects of this increased heat density.
Lower Power
By eliminating the electrical reach between switch ASICs and optical modules, CPO offer significantly lower power requirements as a fundamental design benefit. Further, the energy efficiency of Phononic’s thermoelectric solutions, ~30% lower than competitors, makes Phononic uniquely advantaged in this space.
Improve Uptime & Signal Integrity
Integrating optics directly beside the switch ASIC reduces electrical loss, enables more lanes, higher data rates and denser switch architecture that can scale well. Phononic’s highest quality production and breadth of reliability testing makes us uniquely enabled to deliver these solutions reliably for long-term utilization
Applications
Phononic's Approach to CPO
Co-Packaged Optics from Phononic: Unmatched Bandwidth, Efficiency and Scalability for AI Data Centers
Exponentially growing bandwidth demands are driving an inevitable evolution to tightly integrating optics with switching silicon through co-packaged optics to allow networks to keep pace.
By ensuring precise temperature stability for lasers and optical components placed alongside the switch ASIC, solid state TECs enhance performance and stability while enabling higher-density, lower-power and scalable networks.
Contact Us to Unthrottle Your Data Center Performance
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Solid State Technology
We’ve combined each engineering discipline—pumping heat, moving heat, and controlling heat—to create a revolutionary thermoelectric system that offers endless benefits and true innovation. This is solid state greatness.
Sustainability
As the global leader in solid state cooling technologies, our thermoelectric devices and integrated products are mission critical to cooling data center servers, enabling sustainable cold chain e-grocery growth and bringing the promise of Net Zero within reach to building owners and developers.
Our Company
At Phononic, we believe the world deserves a better way to cool and heat. Our solid state chip has the power to transform our daily lives, cooling and heating our modern world responsibly, without toxic refrigerants. Join us in delivering the solid state technology platform that the world needs.