Unlock AI Performance with Precise, Predictive Cooling from Phononic
AI workloads are dynamic—and throttling is a silent performance killer. Phononic’s cooling solution tackles this head-on. By delivering precise, proactive temperature control at critical thermal junctions, our approach keeps your systems running at peak performance - resulting in fast ROI for your AI investments!
Data Center Cooling
The Benefits of Phononic’s Cooling Solution
The Power of Precision: Precision Temperature Control. Precision Action Times.
Phononic’s TEC-enabled cooling is capable of precisely isolating temperature control, for example separating HBM temperatures from GPUs. In addition, with nano-response times, Phononic unlocks the ability to precisely manage temperatures, in real-time. This approach optimizes bandwidth performance, reduces latency, and can even enable cost savings without compromising.
Don’t Just Respond to AI Workload Variability. Anticipate. Adjust. Accelerate.
Predictive thermal control keeps workloads optimized. Phononic’s approach to cooling in the data center incorporates proprietary and industry standard software and firmware that allows cooling to see increased AI workloads and – proactively, predictively – cool components and hot spots to mitigate the performance drags of throttling.
Unlock AI Compute Performance, Deliver ROI in Months
AI workloads are fundamentally different than legacy compute workloads. They are unpredictable, highly variable, high-density peaks that tax current systems, trigger throttling and present a drag on overall AI compute performance. With Phononic’s approach to AI data center cooling, there is a better way. An approach that precisely and predictively controls temperature at critical compute junctions to ensure all components operate at their respective peak of performance, unblocking incremental compute capacity that has been previous uncapitalized with legacy cooling approaches.
Applications
xPUs and switch ASICs
Increase TDP while maintaining today’s thermal management architecture
Most data centers still rely on air cooling, using fans and conventional heat exchangers that are nearing their thermal limits as rack densities and chip power rise. The Thermal Design Power (TDP) of xPUs and switch ASICs continues to increase with higher core counts and port densities, driving the need for more efficient thermal management. Traditional upgrades—larger heat exchangers, taller chassis, and increased airflow—come with trade-offs like reduced rack space and higher fan noise. Thermoelectric cooling offers a compact alternative, boosting chip TDP by up to 20% without changing airflow or system architecture. These millimeter-thick devices fit standard server and switch layouts, activating only when needed to maintain safe operating temperatures. This approach extends the viability of existing air-cooled infrastructure while supporting next-gen semiconductor performance.
xPUs
Improve performance with selective cooling of multi-chip modules and memory
Advanced semiconductor packaging is enabling multi-chip modules with compute and memory die, each operating at distinct optimal temperatures. Traditional cooling methods often overcompensate or accept performance trade-offs to manage this thermal complexity. Cooling strategies like Direct Liquid Cooling (DLC) with cold plates are commonly used, but maintaining ideal temperatures across diverse components often requires lowering coolant temperatures, increasing energy consumption. Phononic’s approach uses thermoelectric chips (TECs) integrated with cold plates and control software to thermally decouple compute and memory die. This allows HBMs to operate at higher bandwidth and dissipate more power without exceeding thermal limits.
CDUs
Cooling for the increasing demands of 1MW AI server racks
AI is rapidly increasing server rack power densities, creating major thermal management challenges for data centers. As compute power rises, Technology Cooling System (TCS) temperatures must drop to protect hardware, while facilities aim to raise FWS temperatures to reduce energy consumption and minimize reliance on mechanical chillers.
As server power rises, TCS temperatures must drop to maintain safe operating conditions. CDUs equipped with TECs offer a solution by dynamically adjusting cooling modes— leveraging passive cooling during low demand and activating thermoelectric cooling during peak loads. This approach enables stable TCS temperatures while allowing FWS temperatures to rise, improving energy efficiency by 2–3% for every 1°C increase in FWS temperature.
Contact Us to Unthrottle Your Data Center Performance
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READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
Thermoelectric Cooling Experts
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.