Software-Enabled, Dynamically-Controlled Cooling
Workload-Aware, Deterministic System that Unlocks Performance in Real-Time
Phononic’s wealth of firmware and software expertise is now unlocking a next generation of truly intelligent, predictive cooling. Delivered via the Thermal Kit, our embedded firmware, Redfish-compatible open-source interfaces and SaaS analytics enable data center architects and operators to constantly learn, optimize and refine the performance of their infrastructure, unlocking uptime and incremental compute performance.
Predictive Cooling Software & Firmware | Redfish-Compatible
Benefits of Phononic Software-Enabled Cooling
Eliminate Cooling Overshoot, Recover Throttle Window
Embedded firmware and Redfish-compatible open-source interfaces provide operators real-time analytics and insight to avoid or suppress thermal excursions. Software connectedness and millisecond action times combine to unlock predictive cooling, precise workload distribution, avoidance of pre-throttle performance divergence and a deterministic thermal envelope.
Improved Uptime, Asset Longevity
The two-way connection further enables operators to detect early signs of thermal stress, and take proactive action to mitigate and address. Such insight avoids downtimes, productivity losses and meaningfully extends the device life.
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READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
Thermoelectric Cooling Experts
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.