Unmatched Bandwidth, Efficiency and Reliability
CPO is the Next Frontier to Meet AI Data Center Demands
Exponentially growing bandwidth demands are driving an inevitable evolution to tightly integrating optics with switching silicon through co-packaged optics to allow networks to keep pace.
By ensuring precise temperature stability for lasers and optical components placed alongside the switch ASIC, solid state TECs enhance performance and stability while enabling higher-density, lower-power and scalable networks.
In addition to addressing the extreme thermal challenges of external laser sources, Phononic’s approach to CPO cooling is perfectly suited for the inevitable market transition to co‑packaged optics more broadly, unlocking additional performance headroom, reducing signal‑path distance and associated energy draw, enabling the scale and bandwidth density required for next‑generation fabrics while not compromising on quality or uptime requirements.
CPO Cooling: Thermal Kit for Co-Packaged Optics
Benefits of Phononic Solutions for CPO
Phononic’s CPO-Ready Thermal Kit: Advanced packaging and localized cooling for co-packaged optical engines in scale out and scale up applications
Higher Bandwidth Density
Eliminating the need for long, high-speed electrical traces between the switch ASIC and the optical modules, CPO allows for many more optical channels to be placed in the same physical footprint, thus enabling far denser, higher-throughput connects. Phononic’s proprietary 3D modeling enables our FAEs to design solutions that accurately model and mitigate the effects of this increased heat density.
Lower Power
By eliminating the electrical reach between switch ASICs and optical modules, CPO offer significantly lower power requirements as a fundamental design benefit. Further, the energy efficiency of Phononic’s thermoelectric solutions, ~30% lower than competitors, makes Phononic uniquely advantaged in this space.
Improve Uptime & Signal Integrity
Integrating optics directly beside the switch ASIC reduces electrical loss, enables more lanes, higher data rates and denser switch architecture that can scale well. Phononic’s highest quality production and breadth of reliability testing makes us uniquely enabled to deliver these solutions reliably for long-term utilization
Applications
Phononic's Approach to CPO
Co-Packaged Optics from Phononic: Unmatched Bandwidth, Efficiency and Scalability for AI Data Centers
Exponentially growing bandwidth demands are driving an inevitable evolution to tightly integrating optics with switching silicon through co-packaged optics to allow networks to keep pace.
By ensuring precise temperature stability for lasers and optical components placed alongside the switch ASIC, solid state TECs enhance performance and stability while enabling higher-density, lower-power and scalable networks.
Contact Us to Unthrottle Your Data Center Performance
Looking for more?
READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
Thermoelectric Cooling Experts
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.