Reduce Thermal Throttling, Unlock 3X ROI
Higher Sustained GPU Performance, Improved Overall Cluster Stability
Phononic’s GPU HBM cooling solution delivers up to 0.15 PUE savings, 5X lifetime improvement, 40% greater compute performance, and a 3X ROI over five years. It’s a solution specifically engineered for rapidly evolving AI training and inference workloads, and the unique requirements of HBM 3 and later generations. The GPU cooling solution maintains stable operating conditions under dynamic thermal loads, unlocking higher performance through reductions in thermal throttling.
This solution is readily deployable with existing nodes and racks.
Phononic Thermal Kit: Solid State Cooling for GPU HBMs
Benefits of Phononic GPU HBM Cooling
Up to 0.15 PUE Savings
Millisecond action times enables cooling precisely when, where and for the exact duration required. Cooling overshoot can now be eliminated, and a new era of precision thermal control is unlocked. Maintain optimal operating envelopes during sustained high-compute workloads through throttle-free performance that significantly improves PUE.
Up to 40% Greater Compute Performance
The software integration of Phononic’s Thermal Kit enables precision control of HBM temperatures, in real-time. By decoupling xPU and HBM temperatures, and maintaining those temperatures as workload increases, the millisecond response of TECs unlocks more performance.
Avoidance of pre-throttle performance divergence and recovery of throttle window further pay performance dividends, unlocking potential previously hindered by thermal throttling.
Up to 5X Device Life Extension
Thermal telemetry and system-level connectivity improves operational predictability, enabling better workload orchestration and enhances rack-level efficiency, predictively. The avoidance of these device stresses unlocks up to 5X device life extension, and improved uptime.
Applications
xPUs and Switch ASICs
Increase TDP while Maintaining Today’s Thermal Management Architecture
Most data centers still rely on air cooling, using fans and conventional heat exchangers that are nearing their thermal limits as rack densities and chip power rise. The Thermal Design Power (TDP) of xPUs and switch ASICs continues to increase with higher core counts and port densities, driving the need for more efficient thermal management. Traditional upgrades—larger heat exchangers, taller chassis, and increased airflow —come with trade-offs like reduced rack space and higher fan noise. Thermoelectric cooling offers a compact alternative, boosting chip TDP by up to 20% without changing airflow or system architecture. These millimeter-thick devices fit standard server and switch layouts, activating only when needed to maintain safe operating temperatures. This approach extends the viability of existing air-cooled infrastructure while supporting next-gen semiconductor performance.
xPUs
Improve performance with selective cooling of multi-chip modules and memory
Advanced semiconductor packaging is enabling multi-chip modules with compute and memory die, each operating at distinct optimal temperatures. Traditional cooling methods often overcompensate or accept performance trade-offs to manage this thermal complexity.
Cooling strategies like Direct Liquid Cooling (DLC) with cold plates are commonly used, but maintaining ideal temperatures across diverse components often requires lowering coolant temperatures, increasing energy consumption. Phononic’s approach uses thermoelectric chips (TECs] integrated with cold plates and control software to thermally decouple compute and memory die. This allows HBMs to operate at higher bandwidth and dissipate more power without exceeding thermal limits.
Contact Us to Unthrottle Your Data Center Performance
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READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
SOLID STATE TECHNOLOGY
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.