AI workloads are driving higher power densities and tighter thermal tolerances as data centers move toward 1.6T, 3.2T, and co‑packaged optics (CPO). For temperature‑sensitive components like EML and CW lasers, external laser sources for CPO, and optical engines, conventional cooling approaches are no longer enough.
Phononic’s solid‑state cooling is purpose‑built for these challenges. By right‑sizing cooling at the device level, Phononic delivers precise, reliable thermal control that supports optical performance as systems scale. Combined with proven high‑volume manufacturing and deep customer integration, these solutions are designed to move from concept to deployment—at the volumes AI data centers demand.
VIDEO TRANSCRIPT
[Ana Berry]
I’m Anna Berry here at OFC 2026 in Los Angeles. I’m speaking with Matt and Brooks at Phononic. Now, Brooks, I want to start with you. What makes Phononic solid-state cooling better for optical devices and AI data centers?
[Brooks Henderson]
Great, so it’s great to be here at OFC 2026. There are a number of different challenges that AI data centers are presenting, specifically in the thermal space. And our solid-state cooling technology is optimized for optical networking and various parts of the thermal challenges in the data center. So EML lasers, CW lasers, external laser sources for co-package optics, even moving into on the optical engines themselves and in the server. We are able to right-size our cooling technology and solutions for the problems that our customers are facing, which are only growing larger with the AI workloads.
[Ana Berry]
So as the market moves to 1.6T, 3.2T and CPO, what positions Phononic to meet these demands?
[Brooks Henderson]
Right, so the volumes are growing to levels that those of us at this conference have never seen. It’s really exciting. So the demand is there and our high volume manufacturing process is able to scale to meet those demands. We are tightly integrated with our customers and can design the right solution for their problem and scale it and deliver it.
