AI workloads are driving higher power densities and tighter thermal tolerances as data centers move toward 1.6T, 3.2T, and co‑packaged optics (CPO). For temperature‑sensitive components like EML and CW lasers, external laser sources for CPO, and optical engines, conventional cooling approaches are no longer enough.
Phononic’s solid‑state cooling is purpose‑built for these challenges. By right‑sizing cooling at the device level, Phononic delivers precise, reliable thermal control that supports optical performance as systems scale. Combined with proven high‑volume manufacturing and deep customer integration, these solutions are designed to move from concept to deployment—at the volumes AI data centers demand.
