Unlocking Data Center Performance, One Hot Spot at a Time
Phononic’s Thermal Kit for GPUs and AI Accelerators Minimize the Effects of Throttling at the Node-Level
Through a proprietary combination of Phononic’s industry-leading TECs, integrated software and control firmware, and leading-edge Phononic thermal design expertise and proprietary IP, the Phononic Thermal Kit is readily deployable anywhere heat is throttling performance across the data center. Not a one size fits all solution, rather a standardized approach to unblocking performance and delivering meaningful ROI for all.
Thermal Kit
Spot Cooling for Data Center Performance
Take precise, predictive cooling directly to the source of the heat to unlock AI compute performance gains.
Hardware
Deployed broadly in AI datacenters across the globe and at every major hyperscaler, Phononic is the market leader in leading-edge 1.6T with millions of deployments encompassing 400G, 800G and more. Phononic TECs set the standard for heat flux density and power efficiency, consistently delivering 30% energy savings as compared to nearest competitors.
Software
Phononic’s team has deployed its deep expertise in software/ firmware to unlock truly predictive cooling capabilities across the data center. Through integrations with industry standard interfaces, including Redfish and others, and an overlay of Phononic proprietary approaches to software integrations for TEC-based cooling, truly predictive cooling for data centers is a ready solution.
Design Services
Our Field Application Engineering (FAE) team has decades of experience and knowledge, and hundreds of patented materials, approaches and designs at their disposal that collectively ensure Phononic’s TECs are consistently at the cutting edge of today’s technology, empowering our customers to not only meet the current market demands but be fully prepared to meet and exceed the skyrocketing bandwidth requirements of tomorrow.
At Phononic we have a proprietary approach to our design process. With millions of our TECs in the field, this time-tested approach consistently produces the highest quality of results.
Technical Papers
Accelerating the Future of AI
Data center investment has surged globally, driven by relentless demand for AI and a broader global reliance on digital infrastructure. Capital investment in data center construction reached $31.5 Billion USD in 2024 and is projected to reach $1 Trillion USD by 2028.
AI infrastructure is particularly challenging to manage, featuring higher-power density and non-uniform workloads, often in space constrained environments. To put this in context, AI racks are already pushing 120 kW, and heading toward 1 megawatt.
As data centers continue to scale, they will necessarily face revenue-limiting power constraints. Computational requirements for modern AI will continue to grow exponentially. At a very basic level, if data center operators and architects can’t cool these extraordinarily dense racks, they certainly can’t scale it.
Contact Us to Unthrottle Your Data Center Performance
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Solid State Technology
We’ve combined each engineering discipline—pumping heat, moving heat, and controlling heat—to create a revolutionary thermoelectric system that offers endless benefits and true innovation. This is solid state greatness.
Sustainability
As the global leader in solid state cooling technologies, our thermoelectric devices and integrated products are mission critical to cooling data center servers, enabling sustainable cold chain e-grocery growth and bringing the promise of Net Zero within reach to building owners and developers.
Our Company
At Phononic, we believe the world deserves a better way to cool and heat. Our solid state chip has the power to transform our daily lives, cooling and heating our modern world responsibly, without toxic refrigerants. Join us in delivering the solid state technology platform that the world needs.