Introducing Phononic’s Thermal Kit: a precise, predictive, performance-enhancing cooling solution that unthrottles AI compute workloads and delivers attractive ROI.

Phononic's unparalleled design delivers cooling under tremendously challenging conditions

Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.

Power densities of data centers are increasing at an alarming rate as AI is transforming business globally.

Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.

Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.

Phononic’s own Chief Product Officer, Larry Yang, discusses the latest from Phononic Data Center Cooling solutions in his recent article on The Fast Mode.

Dinis and Larry explore building sustainable innovation through solid state technology as well as how Phononic is redefining what’s possible in cooling and beyond.

The 2025 NVIDIA GTC conference made one thing clear: the AI revolution is here — and it’s power-hungry.

The Optical Fiber Communication Conference and Exhibition (OFC) 2025 in San Francisco provided a platform for showcasing the latest advancements in optical communications.

AI is driving explosive growth in high-performance computing, accelerating the transition to 800G and 1.6T optical transceivers. But as data demands skyrocket, so do thermal challenges.

The explosive growth of AI, ML and cloud computing is driving extraordinary demand for high-bandwidth optical transceivers.