Ushering In a New Era of AI Data Center Performance
Phononic, the global leader in solid state cooling technology, is expanding its portfolio of advanced cooling solutions for networking, GPUs, and AI data centers.
Unleashing AI Performance: Why Cooling is Now as Critical as Compute
AI Innovation Is Accelerating — and So Are Performance Demands AI capabilities continue to expand into every corner of business and daily life — from large language models and multimodal generative systems to computer vision, fraud detection, and predictive analytics. As users, we expect richer outputs, higher accuracy, and faster response times. All of this […]
The Hot News Heard Around the Chillers: Optimizing Your AI Cooling Investments
As we continue to see, AI workloads continue to scale to unprecedented levels. Underpinning this though is the need to cool AI infrastructure. Performance must be maximized to feed this insatiable growth and cooling is the key. Market experts vary on the exact costs, with ranges varying from $10 billion to $80 billion per year, […]
Thermal Kit: Cooling to Unthrottle AI Performance
Introducing Phononic’s Thermal Kit: a precise, predictive, performance-enhancing cooling solution that unthrottles AI compute workloads and delivers attractive ROI.
Responsive CDUs for AI Factory Energy Efficiency
Power densities of data centers are increasing at an alarming rate as AI is transforming business globally.
Innovative Approaches to Data Center Cooling for AI, Edge, and High-Performance Computing
Phononic’s own Chief Product Officer, Larry Yang, discusses the latest from Phononic Data Center Cooling solutions in his recent article on The Fast Mode.
Improve performance; up to 60% gains in TDP with constant TCase versus industry standard.
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
Increase TDP While Maintaining Today’s Thermal Management Architecture
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
Accelerating the Future of AI
Responsive Cooling enables a higher thermal design power (TDP) for xPUs and switch ASICs heat exchanger and airflow while maintaining the same max operating temperature.
The Future of Data Center Cooling: Insights from NVIDIA GTC 2025
The 2025 NVIDIA GTC conference made one thing clear: the AI revolution is here — and it’s power-hungry.
What is Spot Cooling?
Spot cooling provides temperature stability for sensitive electrical components. It enables temperature control of the individual components in a larger system or subsystem. Examples of spot cooling solutions include using active or passive cooling solutions to selectively cool an individual electronic component within a larger electronic assembly, or cooling a laser within a subsystem such […]