AI is breaking the limits of traditional data center design—and thermal is now the bottleneck. In this session with Data Center Dynamics, Phononic’s President & COO Ryan Parker reframes thermal management from a passive constraint to an active lever for performance. As GPU densities surge, legacy approaches need a boost to keep pace with rack density, heat and performance requirements. The solution: make cooling intelligent, precise, and integrated at the chip level. By combining solid state cooling with Phononic’s real-time Thermal Fabric™ control layer, operators can dynamically tune performance, efficiency, and reliability—at scale.
