Unlocking Data Center Performance, One Hot Spot at a Time
Phononic’s Thermal Kit for GPUs and AI Accelerators Minimize the Effects of Throttling at the Node-Level
Through a proprietary combination of Phononic’s industry-leading TECs, integrated software and control firmware, and leading-edge Phononic thermal design expertise and proprietary IP, the Phononic Thermal Kit is readily deployable anywhere heat is throttling performance across the data center. Not a one size fits all solution, rather a standardized approach to unblocking performance and delivering meaningful ROI for all.
Thermal Kit
Spot Cooling for Data Center Performance
Take precise, predictive cooling directly to the source of the heat to unlock AI compute performance gains.
Hardware
Deployed broadly in AI data centers across the globe and at every major hyperscaler, Phononic is the market leader in leading-edge 1.6T with millions of deployments encompassing 400G, 800G and more. Phononic TECs set the standard for heat flux density and power efficiency, consistently delivering 30% energy savings as compared to nearest competitors.
Software
Phononic’s team has deployed its deep expertise in software/ firmware to unlock truly predictive cooling capabilities across the data center. Through integrations with industry standard interfaces, including Redfish and others, and an overlay of Phononic proprietary approaches to software integrations for TEC-based cooling, truly predictive cooling for data centers is a ready solution.
Design Services
Our Field Application Engineering (FAE) team has decades of experience and knowledge, and hundreds of patented materials, approaches and designs at their disposal that collectively ensure Phononic’s TECs are consistently at the cutting edge of today’s technology, empowering our customers to not only meet the current market demands but be fully prepared to meet and exceed the skyrocketing bandwidth requirements of tomorrow.
At Phononic we have a proprietary approach to our design process. With millions of our TECs in the field, this time-tested approach consistently produces the highest quality of results.
Technical Papers
Accelerating the Future of AI
Data center investment has surged globally, driven by relentless demand for AI and a broader global reliance on digital infrastructure. Capital investment in data center construction reached $31.5 Billion USD in 2024 and is projected to reach $1 Trillion USD by 2028.
AI infrastructure is particularly challenging to manage, featuring higher-power density and non-uniform workloads, often in space constrained environments. To put this in context, AI racks are already pushing 120 kW, and heading toward 1 megawatt.
As data centers continue to scale, they will necessarily face revenue-limiting power constraints. Computational requirements for modern AI will continue to grow exponentially. At a very basic level, if data center operators and architects can’t cool these extraordinarily dense racks, they certainly can’t scale it.
Contact Us to Unthrottle Your Data Center Performance
Looking for more?
READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
Thermoelectric Cooling Experts
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.