Unprecedented Data Center Growth Demands Unprecedented Performance
Phononic’ solid state technology is revolutionizing the possibilities for thermal management in datacenters. Lower power and higher cooling capacity unlocks incremental compute power beyond the throttling limit - unleash the power and potential of thermoelectric cooling - done right.
Solid State Cooling Solutions
Dynamic Cooling Technology
Traditional cooling methods, passive as well as active – are nearing their limits, especially as datacenter densities and power requirements continue to escalate.
Phononic’s solid state cooling technology provides an innovative solution to address the growing cooling needs of datacenter racks, which are increasingly challenged by rising thermal loads. Specifically, Phononic’s approach combines passive and active cooling strategies as needed to manage heat more effectively, efficiently and precisely as compared to legacy approaches.
Phononic’s solid state cooling is application agnostic, and can be utilized for both air and liquid based cooling systems within datacenter infrastructure.
Unlocking Performance
As datacenter densities and power requirements continue to escalate, traditional cooling methods, such as passive air cooling, are nearing their limits.
Through its unique dynamic cooling functionality, Phononic’s solid state technology makes it possible to simultaneously improve performance and save on power consumption.Â
By integrating dynamic cooling, Phononic can allow critical data center components like GPUs, CPUs and switch ASICs to operate within safe temperature ranges, minimizing the risk of thermal throttling and ensuring optimal performance even under high loads.
Flexible Solution for Strong ROI
The rapidly increasing datacenter power requirements are posing a threat to capacity expansion. At risk is not only the fundamental ability to design-in access to sufficient power, but the ongoing cost requirements and carbon footprint implications present an industry-wide challenge.
Phononic’s solid state technology offers a flexible and scalable solution that reduces operational costs while supporting the continuous growth of data-intensive applications.
This new solution not only enhances the reliability and lifespan of the hardware but also reduces energy consumption, aligning with the evolving demands of modern data centers for greater efficiency and scalability.Â
Applications
ToR Switches
Precision solid state cooling
Phononic’s dynamic cooling technology provides an innovative solution to address the growing cooling needs of Top of Rack (ToR) switches in datacenter racks, which are increasingly challenged by rising thermal loads. Traditional cooling methods, such as passive air cooling, are nearing their limits, especially as datacenter densities and power requirements continue to escalate.
Phononic’s approach combines passive and active cooling strategies to manage heat more effectively and efficiently. By integrating dynamic cooling, Phononic can allow ToR switches to operate within safe temperature ranges, minimizing the risk of thermal throttling and ensuring optimal performance even under high loads.
Compute Core
Redefining compute core cooling
As the power density of CPUs and GPUs continues to increase, traditional cooling methods like air cooling are becoming inadequate, particularly for next-generation workloads that push the limits of thermal design power (TDP). Phononic’s solution leverages a hybrid approach that seamlessly transitions from passive to active cooling as needed, effectively dissipating heat even in the most demanding scenarios. This ensures that the CPU’s & GPU’s remain within optimal temperature thresholds, preventing thermal throttling and enhancing overall compute efficiency.
Additionally, Phononic’s cooling systems are deployable within both existing and future datacenter infrastructures, offering a flexible and scalable solution that reduces operational costs while supporting the continuous growth of data-intensive applications.
Rear Door Cooling
Revolutionize your rack with rear door cooling
As datacenters scale up in power and performance, rear-door cooling solutions must efficiently handle the increased heat loads without compromising space or energy efficiency. Phononic’s approach can integrate advanced passive and active cooling mechanisms that activate based on real-time thermal demands, ensuring that rear-door cooling systems can efficiently dissipate heat even under peak operational loads.
This capability not only helps maintain optimal temperatures for the servers but also reduces the overall energy consumption of the cooling infrastructure. This approach to rear-door cooling in datacenters can enhance the performance and longevity of hardware while achieving greater thermal efficiency, which is essential for supporting the continuous expansion of computing resources.
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Solid State Technology
We’ve combined each engineering discipline—pumping heat, moving heat, and controlling heat—to create a revolutionary thermoelectric system that offers endless benefits and true innovation. This is solid state greatness.
Sustainability
As the global leader in solid state cooling technologies, our thermoelectric devices and integrated products are mission critical to cooling data center servers, enabling sustainable cold chain e-grocery growth and bringing the promise of Net Zero within reach to building owners and developers.
Our Company
At Phononic, we believe the world deserves a better way to cool and heat. Our solid state chip has the power to transform our daily lives, cooling and heating our modern world responsibly, without toxic refrigerants. Join us in delivering the solid state technology platform that the world needs.