Products Optoelectronics

Fully optimized, in every way possible.

Our TECs for optical communication components are superior from end to end—in power consumption, performance vs. size, reliability, and quality. We custom-design our TECs to be optimized for any application and any need.

Engineering benefits.

Icon Image Uncompromised performance

Our TECs deliver 60% higher heat pumping density with 30% lower power consumption, when compared to our competitors’ TECs.

Scalability

We strive to offer precision at scale when it comes to the assembly process. Our TECs are built in a US-based automated manufacturing facility to scale quickly from design into production, reducing NPI timelines.

Unparalleled design

Our design, simulation, and development proposal allows us to create a device that is tailor-made to exact customer needs, minimizing costly redesign risk and ensuring best-in-class performance.

We know and solve your challenges.

Bar growing showing power consumption

Power consumption

With greater need to increase efficiency, power consumption is more critical than ever. Our solid-state technology delivers up to 30% lower power in your application.

Bar chart showing more heat in less space

More heat in less space

Increasing heat density within shrinking form factors is challenging. Our TECs deliver greater heat pumping in a smaller footprint.

Zoomed in view of a networking cable.

Cost-performance trade-off

Today’s manufacturers seek non-hermetic alternatives for cooled laser packages, but many of these solutions will likely fall short in harsh environments and critical applications. Our ReefTEC ™ platform has been tested and proven to enable lower power consumption and help significantly reduce TOSA cost.

Products.

01

TO Can TECs

Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.

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product to can tecs image
02

ReefTEC™ Non-Hermetic TEC Platform

Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.

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ReefTEC component
03

Box TOSA TECs

Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.

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Box TOSA TECs
04

Butterfly Package TECs

TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and Photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.

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Butterfly package
05

Automotive LiDAR TECs

Our TECs for automotive LiDAR applications offer unrivaled active cooling performance and reliability. Work with us to design an application-specific TEC that’s optimized for your LiDAR sensor application!

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Tecs Transparent Drop Shadow Comp (1)

How to buy Phononic

Europe / North America

Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:

Israel

Israel

China

China

Korea

Korea

Japan

Japan

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Don’t see a TEC that works for your application? Let’s design it together.