Thermoelectric Cooling for Box TOSA Lasers

Product Overview

Phononic supports the cooling of Box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. The Box TOSA series are excellent for applications of 100G and higher.

These solutions are perfect for use in QSFP transceiver packages and are fantastic for long-reach requirements (LR4 / 10km max) that are in demand from the growth of co-located and regional data centers. We’ve also worked with customers on single-wavelength 100G applications.

Now, we are working on solutions that support 400G products that are still in early development. Leverage our expertise to plan your future product roadmap. We will not limit you to standard products; all of our solutions are designed to meet your needs.

Have a specific application need? Contact us to discuss your requirements.

Our TECs are configured to give you an edge over your competitors with differentiation inside the package. Learn how we provide solutions for engineers.

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rohs & iso

Applications

  • CFPx (C Form-Factor Pluggable) transceivers
  • QSFP28 and QSFP-DD (Quad Small Form Factor Pluggable) Transceivers
  • 100G LR4 lasers
  • 400G FR4/LR4/LR8 lasers
  • 100G/200G/400G Coherent
  • High data rate LAN-WDM and DWDM (dense wavelength division multiplexing)
  • I-Temp QSFP28 for wireless applications

Benefits

  • Lower power consumption
  • Better heat density
  • Supports 100G-400G applications
  • Scalable design process
  • Compatible with I-temp or C-temp ranges

Integration Options

  • Bare wire bond pads
  • Wire bonding posts
  • Cold side electrical connections
  • High-temperature solder
  • Solder pre-tinning
  • Patterned cold-side metallization
  • Pre-attached cold-side thermistor
  • Automation-ready packaging

Box TOSA Product Specifications

product specifications

Solution for: