Scalable Solid State Cooling for Any Application
Compact, energy-efficient, refrigerant free, and infinitely scalable, Phononic’s proprietary approach to solid state cooling can be readily deployed across a wide range of industries and applications. Phononic’s approach enables real-time thermal orchestration through the combination of proprietary software, firmware and thermoelectric (TEC) hardware that delivers fine-grained, chip-level thermal control. Partner with Phononic to unleash the full power of solid state cooling for your application.
Where We Cool
Phononic Active Cooling Solutions™ are leading the way in the cooling revolution for optoelectronics. Whether that is cooling high-speed optical transceivers, or providing critical reliability to LiDAR sensors and setting the bar for new driver safety standards.
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READILY-DEPLOYABLE THERMAL KITS
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits. Thermal Kits integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC
Underpinned by Phononic’s Thermal Kits deployed across the data center, Phononic’s Thermal Fabric is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
SOLID STATE TECHNOLOGY
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.