Scalable Solid State Cooling for Any Application
Compact, energy-efficient, refrigerant free, and infinitely scalable, Phononic’s proprietary approach to solid state cooling can be readily deployed across a wide range of industries and applications. Phononic’s approach enables real-time thermal orchestration through the combination of proprietary software, firmware and thermoelectric (TEC) hardware that delivers fine-grained, chip-level thermal control. Partner with Phononic to unleash the full power of solid state cooling for your application.
Where We Cool
Phononic Active Cooling Solutions™ are leading the way in the cooling revolution for optoelectronics. Whether that is cooling high-speed optical transceivers, or providing critical reliability to LiDAR sensors and setting the bar for new driver safety standards.
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READILY-DEPLOYABLE THERMAL KITS™
Phononic’s proven high‑performance thermoelectric coolers (TECs), combined with integrated mechanical and thermal architecture and API‑accessible control firmware and software, provide precise, performance‑enhancing, node‑level cooling when deployed in our Thermal Kits™. Thermal Kits™ integrate with existing liquid or air cooling systems, and enable rapid, chip-level hotspot thermal control from transceivers to co-packaged optics to HBM GPUs and more.
INTELLIGENT THERMAL FABRIC™
Underpinned by Phononic’s Thermal Kits™ deployed across the data center, Phononic’s Thermal Fabric™ is a software-defined, TEC-enabled control layer that is converting thermal management into a real-time, system-level optimization across the entire AI data center. Enabling millisecond control of cooling, real-time thermal telemetry and analytics, workload-aware orchestration and seamless software integration, our solutions are cooling the data centers that are enabling AI.
Thermoelectric Cooling Experts
Thermoelectrics have existed for over a century—but Phononic has redefined them. By integrating heat pumping, transport, and control, we created an efficient, scalable, and sustainable thermoelectric system. Our TECs deliver 60% higher heat pumping density and up to 30% lower power use as compared to industry standards, and are backed by Phononic’s consultative, application‑specific engineering approach so we consistently deliver the right configuration for your specific application.