AI is driving explosive growth in high-performance computing, accelerating the transition to 800G and 1.6T optical transceivers. But as data demands skyrocket, so do thermal challenges.
At OFC 2025 (March 30 – April 3), Phononic is showcasing breakthrough solid-state thermal solutions that are redefining efficiency and performance. With over 25M+ TECs deployed, our technology is enabling next-gen AI servers, networks, and data centers.
Stop by Booth #5129 to:
– Meet our thermal experts & design engineers
– Explore cutting-edge cooling solutions for AI-driven data centers
– See how our proprietary TEC design is driving the future of 400G, 800G, and 1.6T transceivers
Don’t miss the opportunity to experience the future of precision cooling firsthand.
