How we design and make TECs
Our consultative approach is unique in the industry. We won’t ask you which TEC (thermoelectric cooler) you want—we’ll ask what it needs to do. With a complete thermal picture of your application, we leverage decades of thermal engineering expertise to develop the right configuration for you—one that maximizes efficiency and exceeds design targets and requirements.
Benefits.
Uncompromised performance
Uncompromised performance
Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.
Precision at scale
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Unparalleled design
Unparalleled design
We deliver unprecedented value and performance by partnering with customers throughout the entire design process—creating application-relevant products/devices/solutions.
Applications.
Data communications
Discover performance at scale for high-volume production, including an industry-leading, cost-saving non-hermetic TEC platform.
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Telecommunications
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
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LiDAR
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
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Products.
TO Can TECs
Our smallest TECs are perfect for TO Can-based laser and detectors from 10G to 25G to 50G and beyond, including PON, 5G mobile and FTTx. Typically less than 3 mm per side and optimized for up to 600 mW of heat.
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ReefTEC™ Non-Hermetic TEC Platform
Completely re-engineered TECs that help enable dramatic cost savings at the package level without sacrificing performance or reliability, for non-hermetic applications.
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Box TOSA TECs
Perfect for TOSAs that support 100G LR4, 100G DR1, and 400G DR4/FR4/ZR products as well as 25G and 50G for mobile applications. Typically 4 to 6mm on a side and optimized to efficiently handle up to 1 W heat loads.
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Butterfly Package TECs
TECs geared for larger packages and heat loads such as pump lasers, DWDM/tunable lasers, and Photonic integrated circuits. These TECs are 5 to 10 mm per side and can handle up to 4 W of heat.
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Ready to build with Phononic? Let’s make it together.
Resources.
Phononic Ranked Number 66 Fastest Growing Company in North America on Deloitte’s 2019 Technology Fast 500™
Phononic ranked number 66 on Deloitte’s Technology Fast 500™, a ranking of the 500 fastest growing technology, media, telecommunications, life sciences and energy tech companies in North America.
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Keeping It Cool, Phononic Cools and Heats With Solid-State Chip
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The NASA Alum Who Turned A Discarded 19th-Century Idea Into a $280 Million Startup
Phononic CEO, Tony Atti shared his thoughts on the start of the company’s solid-state cooling units.
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Beyond the Silicon Valley app: Many of tech’s new disruptive ideas have social missions
The 2019 CNBC Disruptor 50 list is out! This year more than ever we’re seeing technology infiltrate and transform every sector of our society.
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