ReefTEC™ Non-Hermetic TEC Platform

Phononic’s non-hermetic compatible TEC platform is fundamentally re-engineered to provide telecom-grade reliability and unparalleled cooling performance for non-hermetic laser packaging. Our platform addresses the root cause of TEC failure in highly accelerated condensing environments and improve reliability by 5X over hermetic TECs or alternative non-hermetic solutions.

ReefTEC component

Cutting-edge technology.

Uncompromised performance

ReefTEC™ is uniquely capable of enabling optical component suppliers to design out expensive packaging, but maintain the performance benefit of cooling. Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

Extreme reliability

Our ReefTEC platform can meet the most exacting reliability requirements of optical communications components, even in non-hermetic packaging where there is risk of condensation.

Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

How to buy Phononic

Europe / North America

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Phononic has developed several strategic partnerships with leaders in the semiconductor industry. These alliances have allowed us to both expand our global footprint through regional channels, as well as deepen our reach within specific vertical markets. Our existing partners include:

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Contact us to start an application-specific ReefTEC(TM) design for your non-hermetic laser package.