Box TOSA TECs
Phononic supports the cooling of box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. This series is perfect for 100G and higher applications, QSFP transceiver packages, and the long-reach requirements (LR4/10km and beyond) that are in demand from the growth of optical components used in data centers.
Cutting-edge technology.
Extreme reliability
Extreme reliability
The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.
Precision at scale
Precision at scale
Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.
Multiple integration options
Multiple integration options
With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.
Applications.
Data Communications
Discover performance at scale for high-volume production, including an industry-leading, cost-saving non-hermetic TEC platform.
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Telecommunications
Learn about solutions that offer leading performance, significant reductions in power consumption, and high reliability.
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LiDAR
TECs open the door to new functionality and improved sensitivity in LiDAR applications where sensor performance is mission-critical to safety.
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Resources.
The Future of Optical Communications is Cooled
As the data rate demand continues to increase, so too does the need for extremely high performance and cooled optics.
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The Future of Optical Communications is Cooled
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The Future of Optical Communications is Cooled – Infographic
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