Phononic supports the cooling of box TOSA (transmit optical subassembly) laser packages with low-power consumption, high-performance TECs. This series is perfect for 100G and higher applications, QSFP transceiver packages, and the long-reach requirements (LR4/10km and beyond) that are in demand from the growth of optical components used in data centers.

Cutting-edge technology.

Uncompromised performance

Up to 60% higher heat pumping density and up to 30% less power consumption drives global data transmission.

check mark icon Extreme reliability

The process control and in-line metrology employed in our automated manufacturing facility ensure reliability and precision that scale into production, as evidenced by a TEC return rate of 0% in mass production.

Combine shape icon Precision at scale

Our automated manufacturing line with extensive process control and metrology ensures superior quality and reliability in high-volume production.

Multiple integration options

With many integration options available, from bare wire bond pads to high-temp solder, wire-bonding posts, patterned cold-side metallization, and more, you won’t be limited by a standard TEC design.

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