Thermoelectric Cooling for TO Can Lasers

Product Overview

Phononic delivers low power consumption, high-performance TECs to efficiently cool TO Can lasers. All of our thermoelectric cooling solutions are configured for your specific application. This series is ideal for cost-effective, low-data-rate lasers from 1G-50G and beyond, including PON (passive optical networks), wireless network apps and FTTX applications.

These TECs, including our pico-TEC platform, can be used for cooling common package sizes such as TO56 (5.6mm diameter) and can support even smaller packages like TO32 or TO40. They are excellent for use in any package or TOSA form factor where space is at a premium.

Looking for smaller TO Can platforms? Contact us to discuss your requirements.

Our solutions offer a unique differentiation inside the package. Learn more about our solutions for engineers.

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rohs & iso

End-Customer Applications

  • Laser cooling for optical components and telecommunications
  • 10G tunable lasers for DWDM (dense wavelength division multiplexing)
  • Lasers for Passive Optical Network (PON) applications
  • 10G EML (electro-absorption modulated lasers)
  • 1550nm and 1577nm TO can lasers


  • Lower power consumption
  • Better heat density in a very small footprint
  • Cost effective
  • Scalable manufacturing process
  • Compatible with I-temp or C-temp ranges

Integration Options

  • Bare wire bond pads
  • Wire bonding posts
  • Cold side electrical connections
  • High-temperature solder
  • Solder pre-tinning
  • Patterned cold-side metallization
  • Pre-attached cold-side thermistor
  • Automation-ready packaging

TO Can Product Specifications

product specifications

Solution for: