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Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Telecom and Datacom Laser Packages

March 09, 2018 – 

The release of Phononic’s new proprietary thermoelectric cooler platform for laser packages within telecom and datacom was covered in Semiconductor Today. Phononic has experience with both cooled laser packages and non-hermetic laser packages, and this experience plus the design of the new TEC platform will lower package costs for optical components manufacturers.

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